Skip to main content
Springer Nature Link
Log in

Influence of Soldering Temperature on Microstructure and Thermal Properties of FC-LED Filaments Soldered with SAC0307

  • Original Research Article
  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

    We’re sorry, something doesn't seem to be working properly.

    Please try refreshing the page. If that doesn't work, please contact support so we can address the problem.

Abstract

The influence of the soldering temperature on the performance of flip-chip light-emitting diodes (FC-LED) filaments soldered with SAC0307 has been investigated. Scanning electron microscopy (SEM) images, void rates, shearing force, junction temperature, steady-state voltage, blue light luminous flux, and luminous efficiency were measured to characterize the filament performance. The microstructure of the fracture surface after shear failure of the FC-LED filament joints soldered at 250°C and 270°C showed the lowest percentage of voids and was smoother than for the other groups. The shearing force of the FC-LED filament solder joints formed at 250°C and 270°C was higher than that for the other three groups, but the shearing force of all five groups of solder joints exceeded 200 gf. The steady-state voltage and junction temperature of the 250°C and 270°C FC-LED filaments were lower than those of the other three groups, and the blue light luminous flux of the 250°C and 270°C FC-LED filaments was higher than for the other three groups. In conclusion, the FC-LED filaments exhibited good photoelectric performance and thermal reliability when using soldering temperatures between 250°C and 270°C.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Subscribe and save

Springer+ Basic
$34.99 /Month
  • Get 10 units per month
  • Download Article/Chapter or eBook
  • 1 Unit = 1 Article or 1 Chapter
  • Cancel anytime
Subscribe now

Buy Now

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10

Similar content being viewed by others

References

  1. X. Jiang, C. Zheng, C. Mo, X. Wang, J. Zhang, Z. Quan, J. Liu, and F. Jiang, Opt. Mater. 89, 505 (2019).

    Article  CAS  Google Scholar 

  2. S. Pimputkar, J.S. Speck, S.P. Denbaars, and S. Nakamura, Nat. Photonics. 3, 180 (2004).

    Article  Google Scholar 

  3. R. Yu, H. Li, H. Ma, C. Wang, H. Wang, B.K. Moon, and J.H. Jeong, J. Lumin. 132, 2783 (2012).

    Article  CAS  Google Scholar 

  4. J. Magnien, L. Mitterhuber, J. Rosc, F. Schrank, S. Horth, M. Hutter, S. Defregger, and E. Kraker, Microelectron. Reliab. 82, 84 (2018).

    Article  Google Scholar 

  5. A.T. Tan, A.W. Tan, and F. Yusof, J. Alloys Compd. 705, 188 (2017).

    Article  CAS  Google Scholar 

  6. T.T. Chou, R.W. Song, W.Y. Chen, and J.G. Duh, Mater. Lett. 235, 180 (2019).

    Article  CAS  Google Scholar 

  7. X. Hu, Y. Li, Y. Liu, and Z. Min, Microelectron. Reliab. 54, 1575 (2014).

    Article  Google Scholar 

  8. X. Deng, G. Piotrowski, J.J. Williams, and N. Chawla, J. Electron. Mater. 32, 1403 (2003).

    Article  CAS  Google Scholar 

  9. S.P. Ying, C.P. Wang, Y.C. Su, and T.L. Chang, Microelectron. Eng. 160, 1 (2016).

    Article  CAS  Google Scholar 

  10. W.J. Sang, J.H. Kim, and H.M. Lee, J. Electron. Mater. 33, 1530 (2004).

    Article  Google Scholar 

  11. H.L. Hsu, H. Lee, C.W. Wang, C. Liang, and C.M. Chen, Mater. Chem. Phys. 225, 153 (2018).

    Article  Google Scholar 

  12. W. Sabbah, P. Bondue, O. Avino-Salvado, C. Buttay, H. Fremont, A. Guedon-Gracia, and H. Morel, Microelectron. Reliab. 76, 362 (2017).

    Article  Google Scholar 

  13. M. Li, J. Zou, W. Wu, M. Shi, B. Yang, and B. Guo, Appl. Sci. Basel 8, 2254 (2018).

    Article  CAS  Google Scholar 

  14. C. Guan, J. Zou, Q. Chen, M. Shi, and B. Yang, Appl. Sci. Basel 10, 47 (2020).

    Article  CAS  Google Scholar 

  15. X. Zhai, C. Guan, Y. Li, J. Zou, and Y. Li, J. Electron. Mater. 50, 796 (2020).

    Article  Google Scholar 

  16. Y. Liu, F. Sun, H. Zhang, T. Xin, C.A. Yuan, and G. Zhang, Microelectron. Reliab. 55, 1234 (2015).

    Article  CAS  Google Scholar 

  17. Y. Goh, A.S.M.A. Haseeb, H.L. Liew, and M.F.M. Sabri, J. Mater. Sci. 50, 4258 (2015).

    Article  CAS  Google Scholar 

  18. N. Jiang, J. Zou, C. Zheng, M. Shi, W. Li, Y. Liu, B. Guo, J. Liu, H. Liu, and X. Yin, Appl. Sci. Basel 8, 1940 (2018).

    Article  Google Scholar 

  19. L. Wang, W. Li, Y. Xu, B. Yang, M. Shi, J. Zou, Y. Li, X. Qian, F. Zheng, and L. Yang, Chin. Phys. B. 27, 434 (2019).

    Google Scholar 

  20. Y. Liu, S.Y.Y. Leung, J. Zhao, C.K.Y. Wong, C.A. Yuan, G. Zhang, F. Sun, and L. Luo, Microelectron. Reliab. 54, 2028 (2014).

    Article  CAS  Google Scholar 

  21. D.Q. Yu, and L. Wang, J. Alloys Compd. 458, 542 (2008).

    Article  CAS  Google Scholar 

  22. Y.T. Chin, P.K. Lam, H.K. Yow, and T.Y. Tou, J. Mater. Res. 25, 1304 (2010).

    Article  CAS  Google Scholar 

  23. S.H. Tran, L. Dupont, and Z. Khatir, Microelectron. Reliab. 54, 1921 (2014).

    Article  Google Scholar 

  24. W. Wang, J. Zou, Q. Zheng, Y. Li, M. Shi, Y. Li, X. Li, C. Zhang, C. Li, B. Yang, and D. Chen, Appl. Sci. Basel 10, 1373 (2020).

    Article  Google Scholar 

  25. L. Wang, J. Zou, B. Yang, W. Li, Y. Li, M. Shi, W. Zhu, C. Zhang, F. Wang, and Y. Lin, J. Semicond. 39, 43 (2018).

    CAS  Google Scholar 

Download references

Acknowledgments

This work was supported by the Science and Technology Planning Project of Zhejiang Province, China (2018C01046), Enterprise-funded Latitudinal Research Projects (J2016-141, J2017-171, J2017-293, and J2017-243).

Author information

Authors and Affiliations

  1. School of Science, Shanghai Institute of Technology, Shanghai, 201418, China

    Chengyu Guan, Jun Zou, Huizi Liu, Qing Lu,  BoboYang & Mingming Shi

  2. School of Materials Science and Engineering, Shanghai Institute of Technology, Shanghai, 201418, China

    Yang Li

Authors
  1. Chengyu Guan
    View author publications

    You can also search for this author inPubMed Google Scholar

  2. Jun Zou
    View author publications

    You can also search for this author inPubMed Google Scholar

  3. Huizi Liu
    View author publications

    You can also search for this author inPubMed Google Scholar

  4. Qing Lu
    View author publications

    You can also search for this author inPubMed Google Scholar

  5. Yang Li
    View author publications

    You can also search for this author inPubMed Google Scholar

  6. BoboYang
    View author publications

    You can also search for this author inPubMed Google Scholar

  7. Mingming Shi
    View author publications

    You can also search for this author inPubMed Google Scholar

Corresponding authors

Correspondence to Jun Zou or Yang Li.

Ethics declarations

Conflict of Interest

The authors declare that they have no conflicts of interest.

Additional information

Publisher’s Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Guan, C., Zou, J., Liu, H. et al. Influence of Soldering Temperature on Microstructure and Thermal Properties of FC-LED Filaments Soldered with SAC0307. J. Electron. Mater. 50, 4186–4195 (2021). https://doi.org/10.1007/s11664-021-08957-x

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11664-021-08957-x

Keywords