2. Ball Grid. Ball Grid Array' Engineer 3. Equipment and Preventive Maintenance Manager 4. Quality Engineer Manager / Assistant Quality Engineer Manager. $ B.Sc. In Engineering or related fields •$ 3-10 years experience In quality system ...
... Ball Grid Array (BGA) removal, reballing, replacement, warranty and field depot repair. Our facility has the latest technology in assembling surface mount printed circuit boards with both a prototype SMT line as well as a high speed SMT ...
... Ball Grid .Array Engineer Engineer / Process Engineer 13. Quality Engineer 3. Equipment and Preventive Maintenance Manager 14. Test Engineer 15. Secretary / Administration Assistant 4. Quality Engineer Manager / Assistant Quality ...
... Ball Grid Array (BGA) removal, rebelling, replacement, warranty and field depot repair. Training Manager. Training workforce in business processes Auditing of business process performance Manage Re-certification Program Training Course ...
... ball grid array to provide integrated circuits with more power and expand those circuits with 256 to 500 pins. „. ,The 1997 expansion program brings to about $50 million the new investments which TI is pouring in to its Baguio plant from ...
... ball grid array 2 (FCBGA2) which the Peza board claimed was not entirely different from one of its existing activities in terms of machinery and equipment and manufacturing process, particularly the production of controlled collapse ...
... ball grid array (FBGA) which is widely used in several consumer electronic products. An FBGA is an input to the slow memory random access device used in cellphones and pagers. It is also used for clocks in computers to coordinate its ...
... Ball Grid Array and RF Power manufacturing operations in the world. Software development remains as one of our key priority areas in Malaysia. This is evident through our Multimedia Super Corridor (MSC)-status Software Center which is ...
... Ball Grid Array Substrate Rigid Ball Grid Array Substrate COF Substrate TCP Substrate. Light Emitting Diode (LED) Assembly and Test. - Multi chip module Display Contact Persons: Yoshihiko Okamoto - President Gemma Tapang - COO Hisanori ...
... Ball Grid Array (BGA) process equipment will be an added advantage. Candidates for the position of Technical Support Engineers should possess at least 3 years of experience in providing maintenance services for semiconductor ...