This study utilized Moldex3D molding simulation software to analyze very thin profile fine pitch ball grid array (VFBGA) packages and established a numerical...
8 months ago

This study investigated the effectiveness of heat shield placement locations during the rework process to avoid thermal and mechanical damage to adjacent ball...
31 months ago

This study utilizes moiré interferometry to investigate the thermo-mechanical deformation behavior of wire-bonded plastic ball grid array...
11 months ago

The shear fatigue performance and fracture behavior of microscale ball grid array (BGA) structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints with...
7 months ago

Samsung Electro-Mechanics is expected to develop a flip chip ball grid array (FC-BGA) for Apple's next-generation PC processors.
36 months ago

Download scientific diagram | Typical IC packaging components in a ceramic ball grid array (CBGA) package disassembled (left), assembled (right), showing a...
13 months ago

The global ball grid array (BGA) packaging market is poised for steady growth, with market size projected to reach USD 1.29 billion in 2024.
2 months ago

The ball grid array packaging industry continues to expand as the demand for high-performance denser type compact packaging continues to...
5 months ago

The interfacial reactions and ball shear properties of an In–48wt%Sn solder joint with an electroplated Au/Ni ball grid array substrate were investigated
103 months ago

The C-SAM (C-mode scanning acoustic microscopy) is the preferred method for finding air gaps such as delamination, cracks, voids, and porosity.
11 months ago