I'm really surprized this is reliable (of course they know what they are doing). Maybe because all the wirebonds to the dies are encased in epoxy (?) and the other bonds are so thick. Even then I would be worried they would snap off or lift their pads.
I wasn't directly involved but I still have nightmares about wirebonding. For a large partice physics experiment, we bonded electronics to silicon (wafer) sensors. Those small bonds would start oscillating and break as soon as there was any noise with their resonance frequency. It took cooling and heating cycles also pretty badly. In the end they sorted out all problems somehow, but the association "wirebond = delicate" stuck with me.
This isn't epoxy, it's some sort of sticky soft coating. Wirebonds looks fragile to me too, but after all every packaged chip have wirebonded pins, so at least it shouldn't be worse.
I wasn't directly involved but I still have nightmares about wirebonding. For a large partice physics experiment, we bonded electronics to silicon (wafer) sensors. Those small bonds would start oscillating and break as soon as there was any noise with their resonance frequency. It took cooling and heating cycles also pretty badly. In the end they sorted out all problems somehow, but the association "wirebond = delicate" stuck with me.