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Large area photonic flash soldering of thin chips on flex foils for flexible electronic systems: In situ temperature measurements and thermal modelling

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Abstract

In this work photonic energy from a high power xenon flash lamp is used for soldering thin chips on polyimide and polyester foil substrates using standard Sn-Ag-Cu lead free alloys. The absorption of the xenon light pulse leads to rapid heating of components and tracks up to temperatures above the solder melting temperature, while the temperature in the organic foil substrates remains low. Due to its high transparency the temperature in the delicate polyester foil remains low enough to avoid damage and allows fast soldering with standard lead-free alloys. The technology is fast and could be applied in-line in roll-to-roll fabrication of flexible electronics. In situ temperature measurements were performed and compared to finite element model predictions of the temperature in the chip during and after application of the photonic pulse. The accuracy of the model is within 10°C for the tested samples, which allows it to be used in developing photonic flash soldering compatible circuit designs.

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Authors and Affiliations

  1. Holst Centre/TNO, HTC31, P.O. Box 8550, 5605, KN, Eindhoven, The Netherlands

    D. A. van den Ende, R. Hendriks, R. Cauchois & W. A. Groen

Authors
  1. D. A. van den Ende
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  2. R. Hendriks
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  3. R. Cauchois
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  4. W. A. Groen
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Correspondence to W. A. Groen.

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van den Ende, D.A., Hendriks, R., Cauchois, R. et al. Large area photonic flash soldering of thin chips on flex foils for flexible electronic systems: In situ temperature measurements and thermal modelling. Electron. Mater. Lett. 10, 1175–1183 (2014). https://doi.org/10.1007/s13391-014-4222-3

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  • DOI: https://doi.org/10.1007/s13391-014-4222-3

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